[Kliment]

It's almost never possible to do a function-compatible die shrink for anything that needs to work over a large voltage and/or temperature range. Many automotive chips operate at 80V or more, 5V and 12V parts are ubiquitous, and indeed lots need bulk area to be able to switch large currents. Making them on small processes is not only an enormous design effort where it's possible at all, it also doesn't make sense because there's still way more capacity on larger processes than on smaller ones, and the only way small processes win is by packing so many dies on a wafer that they can get away with their terrible per-wafer cost and awfully bad defect rate.

[erosenbe0]

Thanks for the informed reply.