2. Complete lack of modularity, serviceability, and odd assembly order. This means minor changes will need mobo redesign. And defect found after test, or on return equals scrapping the unit.
3. Custom mechanical parts used liberally
4. Too many programmable ICs
5. Extremely wasteful use of case space to work around rigidity issues.
2. Complete lack of modularity, serviceability, and odd assembly order. This means minor changes will need mobo redesign. And defect found after test, or on return equals scrapping the unit.
3. Custom mechanical parts used liberally
4. Too many programmable ICs
5. Extremely wasteful use of case space to work around rigidity issues.