[MayeulC]

> our best ~5nm chips could use copper wires to transfer electricity

I thought Aluminium and titanium were used in the lower interconnect layers, but according to [1] you are right.

The tech mentioned in the article is supposedly useful for transistors, not necessarily interconnect though. I guess that would be useful for going beyond planar processes. But at some point our current architectures are already severely limited regarding TDP anyway, so unless you can afford using only 10% of your chips, an architecture revolution is overdue IMO.

[1] https://en.wikipedia.org/wiki/Interconnect_(integrated_circu...