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by scottlamb
2042 days ago
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> The point being made is that the processors that they will package with more memory are going to exist on larger dies. Are they? I don't think this is how AMD does things—all their desktop and Threadripper processors are constructed out of 8-core chiplets. The higher-core count processors just use more chiplets per package, not necessarily larger dies. If Apple's already putting multiple chiplets on one package (core + RAM), I wonder if they'll use the same approach to scaling. |
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