[CountSessine]

This is the case with every foundry, though. It’s the reason GloFo isn’t competitive anymore, for example. What’s more interesting is the physics reason that they tripped up the last generation - what did TSMC do right that Intel did wrong? What bets were made? Which ones paid off?

[Pet_Ant]

I believe the issue was that Intel was leaning harder on EUV trying to make it and burying the competition instead of a more cautious approach by TSMC. Zen 3 is finally using some EUV layers whereas I believe Intel already wanted to use EUV heavily in their "10"nm process.

[wmf]

Nope, Intel 10nm does not use EUV. Zen 3 is made on TSMC N7 (not N7+ as rumored) which also does not use EUV.

[ethbr0]

I feel like the business models are slightly different when you're a contract foundry vs integrated though.

The latter depends on your market share. The former only depends on the total market.