[yazaddaruvala]

It seems to me that Apple Silicon, will eventually start with “Device on Chip” type solutions (i.e. there will no longer be a motherboard). Including vertically integrating OLED construction into the wafer as well.

Similarly, vertically integrating battery construction and housing into the device body, like TSLAs battery day announcement.

Between these integrations, I’m not sure there will be much remaining to automate.

[iamgopal]

whatever you are saying, that they will make, needs to be manufacture as well. Its not like there is iphone printer available on aliexpress.

[yazaddaruvala]

Combining logic chips into the same wafer such that no motherboard is needed is just a matter of wafer size, owning/experience with the IP, and needing connectors for IO like speakers, mic, camera, etc. All trivial to do if you're willing to take on the costs of (or reduce) poor yield and less repair-ability. This is the current trend even for chips in AWS like Graviton.

Silicon Substrate for OLED: https://arstechnica.com/science/2020/03/blinkin-fast-oled-ma...

Details of TSLA's push to make batteries part of the device body. https://www.forbes.com/sites/jamesmorris/2020/09/22/tesla-re...