|
|
|
|
|
by AriaMinaei
2137 days ago
|
|
> except if it means thicker, heavier, less optimized devices Speaking specifically of my MBP Retina, and looking inside, I fail to see how eg. a soldered NVME would make the laptop any thinner. There is plenty of space created by the much thicker heat sink, leaving room for a bunch of components to be modular. The reason all these components are soldered in is to make it hard for users or small shops to do quick repairs and cheap upgrades. You must buy a new laptop for a RAM upgrade. Apple negotiates with component suppliers as a single buyer, drives the price of components down, keeps all the savings to itself, and re-sells the components at an exorbitant markup. It is ridiculous for anyone to think this has got anything to do with quality. |
|
Also, soldering down RAM means you don't have to include support for negotiating the properties and quality of arbitrary RAM sticks, which you'd have to do with socketed RAM; that can mean booting faster and providing more performance.
There are good reasons to design components to work specifically with other components. There are also good reasons to make devices more modular. Both have value, to different users with different use cases.