[zozbot234]

Generally the packaging fails well before the integrated circuits themselves do. Thermal stress is hell on SMD and BGA solder joints, and you can't reach ~100C temperatures routinely without quite a bit of thermal stress.

But 100C is also pretty much Tjunction temperature anyway, which means reaching that temp will in fact cause physical wear and tear on the IC. The wear and tear would probably decay exponentially as you drop away from the Tjunction limit, but that still means you don't want to get too close to it in general.