[mlyle]

Yah, it's BS. But it may be teaching TSMC a whole lot about making larger chips with good yield, and the across-reticle interconnect technology is impressive too and may find some general applicability (e.g. it sounds like something AMD might like).

[atq2119]

Oh, for sure there are things to be learned from this. The responsibility for yield doesn't lie with TSMC though, but with the logic design: to make this kind of integration work, your design has to be able to tolerate a fault essentially anywhere on the wafer surface.

This isn't magic, of course: keep in mind that we already have SRAM with extra capacity for fault tolerance, and multi-core chips which are binned based on the number of functioning cores has been standard for a long time.

[mlyle]

Design to tolerate failures is only one variable in yields. Wafer-scale integration exercises to the limit both our ability to tolerate defects and our ability to minimize them.