[chapplap]

It was removed in Skylake, not Broadwell. Ice Lake reintroduces the FIVR again. The inductors are now in the package substrate (rather than discrete inductors on the package or the weird 3DL module in Broadwell-Y) and efficiency at low power is improved. The latter is obviously extremely important for mobile workloads.

[sitkack]

Do you see integrated super caps or batteries into the package or die at some point?