The CPUs in phones have some sort of TIM (thermal interface material) applied to them, and are either in direct contact with the inner side of the case, or a heatpipe which dissipates the heat elsewhere, over a larger area.
This does nothing of that. It's just sitting there simmering nicely. The only reason i can think of is that they recycled most of a former model, and then shrank the cpu-board which then didn't reach unter the vent anymore.
But how did they even manage to oversee that during testing?
But how did they even manage to oversee that during testing?
HOW?