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by xevb3k
2811 days ago
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Two different stories, about two very different situations. There’s not really much equivalence. The report contains elements are are near impossible, and has other aspects that are very unlikely. It has also been denied far more strongly than the Snowden leaks were. The biggest problem is really why would you do this? Either the report is wrong in significant ways, or it’s not true at all. The chip they show in the article, is a ceramic package which it would be really hard to embed a semiconductor in (because of the temperatures required to fire the ceramic). It looks like it probably would sit on an alternate footprint for the BCM flash. A ceramic part like that (which they say is for signal conditioning) doesn’t belong at that location anyway. If your going to develop some weird SMD capacitor sized package for a microcontroller... why not just develop a new BCM serial flash chip embedding the same functionally? At least that way the boards would look visually similar. So much just doesn’t make sense to me. |
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https://googleblog.blogspot.com/2013/06/what.html