|
|
|
|
|
by jacquesm
2894 days ago
|
|
You can't cool from the inside of that cube without having some way of transporting the heat out of it. All you'd end up doing is heating that inside up to the temperature of the dies and after that there would be no more cooling effect (and this would happen in a few seconds after starting the whole thing up). You could do an 'inverse' of this by cooling the dies from the outside and having the interconnects in the space in between. This would still require a lot of cooling and there would be an issue with connecting the resulting assembly to the underlying PCB. |
|