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by jopython 2930 days ago
I believe Intel's designs are based on a single die compared to AMD threadripper which are multichip.
3 comments

You’re right, but obviously the advantage that used to give them isn’t working out anymore.

AMD’s interconnect seems fast enough, and they don’t have the yield/cost problems from massive single die chips.

More importantly that they can target desktops, high end desktops, and servers with the same exact silicon. So they can amortize their R&D across more units, and of course the supply line is much simpler. So AMD doesn't have to guess ahead of time what mix of ryzen, threadripper, and epyc chips they will sell.
Intel has a lot of multi-chip technology, for example the Omni-Path network is a separate chip included in the cpu module.
Could Intel stick more than one on a single chip?
Yes, but so far they have not, instead investing in on-die mesh interconnects for scaling up core count. Here's an opinion piece on the subject: https://www.anandtech.com/show/12814/a-thought-on-silicon-de...
Their first dual-core processors were multiple chip modules.
They however did not have a proper on-die interconnect and instead communicated over the FSB which made them quite bad at scaling.