[kingosticks]

I think you've missed the point. Strip out the product names (which is all those node numbers are, as you say) and understand that the comment is still entirely correct - they are struggling with their outdated manufacturing method and now losing ground.

[icegreentea2]

Intel is struggling with their manufacturing method, but they aren't wed to it. Everyone is struggling with EUV.

ASML - the guys who make the stuff that all the fab houses use, said that they only shipped 10 EUV machines in 2017. Intel's public statements on EUV is that they will use it when its ready.

TSMC and GF both manufacture their newest large scale production nodes using the same basic technique as Intel (hilarious amounts of exposures and layers at 193nm).

Everyone except Intel has said that they only plan to start rolling out EUV built chips in the later half of this year into next year.

No manufacturer has gained ground with EUV in their products yet.

[kingosticks]

Which sounds like 'everyone except Intel' has gained ground. You don't plan to go into production with something next year if you have not made it work.

[icegreentea2]

I mean, you can announce your plans all you want. Intel did this with their 10nm stuff and now has significant egg on their face for their inability to deliver. Maybe Intel is just playing a tighter PR game given their recent mess up.

But really, EUV is a whole new ball game and its entirely possible for Intel to lose whatever is left of their traditional advantages in the transition.

I just don't think its wise reading too too much into everyone's PR and marketing at this time.

[bgorman]

Semiconductor fab timelines are notoriously overoptimistic. It is undeniable that Intel's fab has been struggling for a few years, but you can't take a Fab at it's word on when it will begin production. More critical is when it reaches high volume maturity at a given node.