As someone without a CPU design backround, would something like this scale pretty linearly with added power and thermal headroom? I assume there are limit that would have to be overcome, but what would an ARM chip in the conditions of an i7 look like?
TDP typically scales as somewhere between the cube and fourth power of the clock speed if you're pushing the envelope (in the sense of running at frequencies where further frequency increase also needs a voltage increase). So having 10x the thermal envelope means you can probably clock about twice as fast, all else being equal.