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by welsh 3198 days ago
Yes. We are also used in BeagleBone Black Wireless (https://beagleboard.org/black-wireless) and BeagleBone Blue (https://beagleboard.org/blue). A lot of us are ex-TIers and have been working with BeagleBoard.org for a long time. This is one of the vehicles to show of the OSD335x-SM, but we also have our own development board that we just released (https://octavosystems.com/octavo_products/osd3358-sm-red/).

Our company does "System-In-Package" which means we integrate bare die, packaged parts and passives on a substrate and then package it up so that it looks like a single BGA from a design / manufacturing standpoint. We source wafers from TI and package everything ourselves. Please feel free to visit the website and look around and let us know if you have any other questions.

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I've been doing research on such things for purposes of addressing hardware subversion in supply chain. What kind of equipment and vendor do you use for packaging bare dies? And what's the current cost of such equipment? Thanks ahead of time.
Please contact us directly (https://octavosystems.com/contact/) if you would like to discuss this more.