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by AlfonsoP 3357 days ago
Think outside the box. Current chips have gates on a dozen metal layers measuring ~1µm, but you could scale to 10,000 layers at ~1mm. Sure there are many unsolved challenge to build 10,000 layers, but there is still PLENTY of space for Moore's law to continue in this 3rd dimension...
2 comments

I assume you mean stacking transistors? This has been tried, and there are serious thermal issues. Where does the heat go in the intermediate layers?
If you could solve both the heat dissipation and yield problems that 3D chips have you would be a very, very rich man.