|
|
|
|
|
by ajaimk
3397 days ago
|
|
This is the first I'm reading about the 32 cores being 4 dies on a package - Not sure how well that will work out in practice. IBM does something similar with Power servers where 2 dies on a package are used for lower end chips. Basically, using multiple dies increases latency significantly between the cores on different dies. This will affect performance. I will not judge till I see the benchmark though :-) |
|