[manarth]

Well, they did (apparently) address the issue in the 6S, by moving the vulnerable components, so presumably they'll have considered this issue in the next iteration. Maybe they'll even restore the metal shields over the chips.

The 7 will probably just have a different set of problems to deal with.

[valine]

Not only that, but in the 6s they also switched to a new grade of aluminum that is significantly less prone to bending.