This is a chip that gets soldered directly on the board. While it is possible to solder this specific chip to a detachable interface that can be removed, I highly doubt anyone will ever do it.
This form factor has a huge advantage for OEMs - they can just slap on a single chip that has everything built in - controller, memory management and the actual storage. Less parts = less convoluted assembly process and that is cheaper. While theoretically you can put a BGA fully integrated SSD SOC like this on a PCI-E card or M2 etc., it kinda beats the purpose.
Personally, I think BGA parts are great. They are small and quite robust mechanically an highly integrated (as you have said).
I did my early engineering years with DIP parts, the days of when you could just desolder the memory device and place with a higher density device are long gone.
This form factor has a huge advantage for OEMs - they can just slap on a single chip that has everything built in - controller, memory management and the actual storage. Less parts = less convoluted assembly process and that is cheaper. While theoretically you can put a BGA fully integrated SSD SOC like this on a PCI-E card or M2 etc., it kinda beats the purpose.