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jobs
user:
SemiTom
created:
2016-03-16
karma:
645
submissions:
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3D NAND’s Vertical Scaling Race
1 points
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AI And High-NA EUV At 3/2/1nm
3 points
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Waking and Sleeping Create Current Transients
2 points
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New Security Approaches, New Threats
1 points
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Predicting Reliability At 3/2nm And Beyond
2 points
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Emerging Apps and Challenges for Advanced Packaging
5 points
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Blockchain Attempts to Secure the Supply Chain
2 points
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How Will Future Cars Interact with Humans
1 points
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MPU vs. MCU
1 points
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Forward and Backward Compatibility in IC Designs
1 points
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Designs Beyond the Reticle Limit
2 points
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New and Innovative Supply Chain Threats Emerging
4 points
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Uniquely Identifying PCBs, Subassemblies, and Packaging
34 points
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10 comments
Faster Inferencing at the Edge
1 points
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Dealing with Sub-Threshold Variation
1 points
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Challenges Linger for EUV
3 points
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Difficult Memory Choices in AI Systems
1 points
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Dealing with Two Different Sides of 5G
2 points
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System-Level Packaging Tradeoffs
1 points
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Regaining the Edge in U.S. Chip Manufacturing
2 points
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A Renaissance for Semiconductors
6 points
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AMD Wants an FPGA Company, Too
4 points
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